Sesi-TGP-20 High-Performance Thermal Conductive Gap Filler Pads for Multi-Industry Heat Dissipation Solutions
Product Details
Introduction
Sesi-TGP-20 Gap pad, Highly conformable / low hardness, Good compressibility & self-adhesive strength, excellent filling performance.
Property
K: 2.0W/m-k
Easily spread out on the uneven surface, Good insulation ,Flame retardant & self-adhesive performance, Low thermal resistance.
Typical Application
Automobile lithium battery radiator
LED Lighting equipment
Power conversion
Computer and peripherals
Router
Memory modules
Size
Hardness tolerance ：±5
Size：200mm×400mm, shape to die cutting by requirement
Thickness：0.25mm to 14mm
The above content and technical information are based on the experimental results of our company, but its not as a legal interpretation or guarantee, before using, user need to assess whether the product is suitable for the purpose of application scope.