Sesi-TGL-20 Premium Thermal Gel - 2.0W/mK High-Performance Gap Filler for Electronics Cooling
Product Details
Introduction
Sesi TGL - 20 thermal conductive gel is a –low deforming force materials, plastically similar to the plasticine , is suitable for a wide variation in thickness requirement of cooling modules or components. Its adhesive properties, without glue layer, good wettability, which can cover the micro uneven surface matching parts fully contact to improve the efficiency of heat conduction.
Different from the heat-conductive grease, the Sesi TGL - 20 conductive gel has no subsidence, which is suitable for screen printing or scraping, and can be customized for parts of different thickness.
Property
K 2.0 W/m·k
Good plasticity , good replacement of Grease Excellent wettability ， Minimize contact heat resistance V-0 Flame Rating Safe and environmentally friendly, RoHS compatible.
Typical Application
CPU
Chips and chipsets
The graphics card
Computer cooling fan
Mass storage facility
Cooling Fan
Configuration, Stotage
Per Sheet Size 230×230 mm，Thickness from 0.50 to 8.0 mm
Canned ：1 kg/Can, 10 kg / bucket
Stored in a cool, dry place. Shelf life is 12 months.
The above content and technical information are based on the experimental results of our company, but its not as a legal interpretation or guarantee, before using, user need to assess whether the product is suitable for the purpose of application scope.