Sesi TPC - 30 Phase Change Thermal Interface Material - 8.0W/mK Ultra-High Performance for Electronics Cooling
Product Details
Introduction
Sesi TPC - 30 thermal conductivity of phase change materials provides extreme low thermal resistance for such as high efficiency processor & the cooling module, the material phase change in 50 to 52 ℃, has certain liquidity but won’t overflow, can fill the gap, wetting contact surface, improving heat transfer ability between hot parts and cooling parts.
Its adhesive properties, without glue layer, good wettability, which can cover the micro uneven surface matching parts fully contact to improve the efficiency of heat conduction
Property
Extreme low thermal resistance （0.016 °C·in2/W @ 20psi）
Good Adhesive surface，easy to use RoHS compatible
Application
Desktop, laptop and server
The microprocessor
Chips and chipsets
NB the cooling module
The graphics card
Storage module
Configuration, Stotage
Standard size 240 × 240 mm, can be cut as demand Thickness can be customized Can be added one adhesive layer
This product is non-toxic and non-hazardous, which is transported by general chemicals and stored in cool (room temperature) & dry place.
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